AMD has revealed new AI chips in the midst of heightened competition with industry giants Nvidia and Intel.
During the Computex tech conference in Taipei, AMD’s chair and CEO Lisa Su emphasized the company’s focus on AI, stating that it is their top priority. She highlighted the transformative impact of AI across various sectors and unveiled the Ryzen AI 300 series designed for next-gen AI laptops. These chips are poised to rival upcoming offerings from Intel, such as the Lunar Lake, and Qualcomm’s Snapdragon X, with plans for collaboration with Microsoft to power laptops featuring the AI chatbot Copilot.
Additionally, Su introduced the Ryzen 9000 series for desktops, positioning them as the fastest consumer PC processors globally for gaming and content creation. Both chip lines are scheduled for release in July, following closely on the heels of AMD’s recent announcement of the Ryzen Pro 8040 and Ryzen Pro 8000 processors capable of running AI workloads.
In response to the escalating AI race, chip manufacturers are striving to introduce faster and more powerful processors. Nvidia recently unveiled its latest AI chips, named “Rubin,” with a commitment from CEO Jensen Huang to accelerate the pace of new AI chip technology releases to annually. AMD echoes this strategy with plans to unveil new AI chip tech every year.
AMD also outlined its data center chip roadmap, including the Instinct MI325X accelerators and teased future releases like the Instinct MI350 and MI400 series. These chips are anticipated to leverage next-generation architecture for enhanced performance and efficiency.
Similar to Nvidia, AMD relies on outsourcing the manufacturing of its chips to foundries, primarily Taiwan Semiconductor Manufacturing Company. The new Ryzen AI 300, Ryzen 9000, and 5th-gen EPYC chips will be based on the latest “Zen 5” architecture, promising widespread adoption across various computing platforms, from supercomputers to PCs and data centers.
